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MIGDAL HAEMEK, Israel , August 9 /PRNewswire-FirstCall/ -- Tower Semiconductor, Ltd., a pure-play independent specialty wafer foundry (NASDAQ:TSEM; TASE: TSEM), today announced that Tower's Advanced Photo Diode (APD)process powers a new series of CMOS Image Sensors for Biomorphic Microsystems Corporation, a supplier of innovative imaging solutions for the cell phone and PDA markets.
Tower's APD process enables improved optical and electrical performance of ultra-small pixels utilizing deep sub-micron process technologies, thus enabling the manufacture of small, cost-effective camera module solutions. Manufactured at Tower's Fab2 in 0.18-micron technology, the products utilizeTower's pixel IP and the company's optically optimized multi layermetallization (OptiMuM(TM)), which achieves dramatically better optical sensitivity by reducing stack height from silicon to micro-lens.
Designed to fit the stringent requirements from one of the six leadingglobal cell phone manufacturers, these new products provide an excellentsolution to the increasing demand for higher image quality on small mobilehandsets. The APD process enables reduction of dark current and temporal noise and thus allows perfect images at low light conditions.
Japanese market research firm Techno Systems Research (TSR) estimates the2008 total market for 3.0-megapixel and 2.0-megapixel CMOS modules to be 50%of the total units, around 300M units.Biomorphic's new series of CMOS image sensors include: - 3.0-megapixed sensor using 2.8-micron pixels - 2.0-megapixed sensor using 3.2-micron pixels - VGA sensor using 3.6-micron pixels
"The race to shrink pixel and camera module sizes without degrading performance requires intensive R&D work with a foundry partner," said Dr.Bimal Mathur , Senior Vice President and Chief Technical Officer of Biomorphic Microsystems. "Tower's expertise in image sensors and its APD technology gaveus a complete solution for optimized pixel performance."