How do you think the new GigE standards will influence the machine vision industry?
Respond or ask your question now!
GENEVA , April 20 /PRNewswire-FirstCall/ -- STMicroelectronics (NYSE: STM)today introduced two new secure microcontrollers designed specifically forhigh-volume 2.5G and 3G (third-generation) mobile-phone SIM cards. TheST21Y036 and ST21Y144 provide 36 Kbytes and 144 Kbytes of user EEPROM,respectively, and they join the ST21Y068, which was announced towards the endof 2006 and is already in volume production. Based on an enhanced 8/16-bit CPUcore with up to 16-Mbytes linear addressing capability, the family is producedin a state-of-the-art 0.13-micron EEPROM technology to meet industry demandsfor high volumes, short lead times and competitive pricing.
Operators need secure SIM products with increased memory capacity to storeand handle the large amounts of data now used in a growing number ofapplications and services in mobile communications products, while maintainingoverall performance and user-friendliness. The ST21Y platform delivers anexcellent performance-to-power-consumption ratio, meeting current GSMconsumption standards.
"With more than 20 years smart card experience behind us, and world-classmanufacturing capability, ST can ship these new ST21 devices in the highvolumes and short timescales that the mobile industry demands," said AndreasRaschmeier, Director of Smart Card Sales and Marketing. "They're optimized for2.5G and 3G products, delivering the high performance with low power drainrequired by the latest applications."
The ST21Y036 and ST21Y144 both include a hardware DES (Data EncryptionStandard) accelerator and user-accessible CRC (Cyclic Redundency Code)calculation block. The user EEPROM areas - which include 64 bytes of user OTP(One Time Programmable) memory - use highly reliable CMOS submicrontechnology, and provide 10-year data retention with a typical Erase/Writeendurance of 500,000 cycles. Software and firmware generation are supported bya comprehensive set of dedicated development tools for software design andvalidation.
The ST21Y036 is entering volume production now; the ST21Y144 is availablein sample quantities, with volume production planned for June 2007 . ST has theunique ability to offer smartcard ICs as sawn wafers and in advanced micro-modules that combine integration and security. The ST21Y devices are availablein 6-contact (D17) and 8-contact (D95) RoHS-compliant modules, with contactassignment compatible with ISO 7816-2. In wafer form, the ST21Y036 is pricedat