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Updated: July 8th, 2008 05:26 PM CDT

Pixelplus Launches Enhanced 1/4.2 Inch PlusPixel(TM) 1.3 Megapixel 'System-On-A-Chip' Image Sensor with Its New Foundry Partner

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via PRNewswire

SEOUL , South Korea , Aug. 18 /PRNewswire-FirstCall/ -- Pixelplus Co., Ltd.(Nasdaq: PXPL), a leading fabless semiconductor company in Korea that designs,develops and markets CMOS image sensors for various consumer electronics applications, today reported the unveiling of the "PO5130", the Company's highly customized and enhanced 1.3 megapixel 'System-on-a-Chip' ("SoC") image sensor for various mobile and non-mobile applications.

Based on the Company's PlusPixel(TM) technology in 0.13 um CMOS process, the PO5130 integrates advanced image signal processing ("ISP") algorithms andrefined 2.6 micron pixel array in a 1/4.2 inch optical format, and delivers enhanced and sharper image quality in low light conditions. This can beattributed to functional features which have been added and fortified in the pixels and the ISP engine embodied in the PO5130.

"We are very excited about the PO5130 as it provides high quality images and reduces optical form factor for slim mobile camera phone applications andexpect that those qualities will effectively address customers' demands," said Dr. Sang-Soo Lee, Chief Technology Officer of Pixelplus. "Given the highly specialized features of the PO5130, we believe the Company is well positioned to cultivate business in the 1.3 megapixel SoC image sensor market, which weenvisage will form an increasingly popular and prominent market for mobile and non-mobile applications in the next few years. For this aim, we have workedclosely with our new foundry partner to optimize the process conditions necessary for enhanced pixel performance in the PO5130."

The PO5130 embeds an on-chip regulator which enables a single 2.8 voltoperation to reduce the costs of camera module solutions. With a two-wireserial interface, the PO5130 can be easily programmed to control operating modes with respect to the exposure time, frame rate, window size, scaling,sub-sampling, and color matrix to produce high quality images in any operating environment.

Samples of the PO5130 are currently available and volume production of the PO5130 is expected to start in the fourth quarter of 2006. The Company alsoplans to feature its newly developed PlusPixel(TM) 1.3 megapixel SoC imagesensor in chip-on-board, ceramic leaded chip carrier, and chip-scale-packaging to support various mobile and non-mobile applications. Consistent with such purpose, Pixelplus expects that the PO5130 will be very useful and attractivein the increasingly popular ultra-thin mobile camera phone market and isworking aggressively with its existing and potential clients through the Company's worldwide network to penetrate and progress in that market. Through those undertakings and based on Pixelplus' solid business relationship withits new foundry partner, the Company anticipates that it can acquire new design wins from global first tier clients and further cultivate and expand its CMOS image sensor business in moving ahead.

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