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SANTA CLARA, Calif. , Feb. 9 /PRNewswire-FirstCall/ -- OmniVision Technologies, Inc. (Nasdaq: OVTI), a leading developer of advanced digital imaging solutions, today introduced a simplified new approach to mobile phone design with its latest innovation in a series of industry firsts. OmniVision's new CameraCube(TM) technology is a three-dimensional reflowable, total camera solution that combines the full functionality of a single-chip image sensor, embedded image processor, and wafer-level optics in one compact, small-footprint package. OmniVision's unique approach has enabled the industry's smallest profile and z-height (down to 2.5 X 2.9 X 2.5 mm), making it an ideal solution for today's ultra-slim mobile phones.
OmniVision's total camera solution also simplifies the supply chain, translating into both cost and time-to-market benefits for mobile phone manufacturers. The Company has already engaged with targeted key customers worldwide on the initial two devices, the OVM6680 (400 x 400) and OVM7690 (VGA), both immediately available in volume production. Additional devices based on the new technology are slated for release throughout 2009.
"Today's announcement represents the culmination of years of strategic planning," said James He , OmniVision Chief Operating Officer. "We carefully identified the elements needed to develop a small footprint, total camera solution. We made a strategic investment in the supply chain with VisEra Technologies, brought the expertise required in-house through our acquisition of OmniVision CDM Optics, and collaborated with the industry's leading wafer-level lens suppliers."
Simplified Approach Streamlines Manufacturing
Because CameraCube technology delivers a complete all-in-one camera solution, mobile phone manufacturing is significantly streamlined. As with any other surface mount device, the reflowable CameraCube devices can be directly soldered to the printed circuit board with no socket or insertion required; thus eliminating the need for additional components, resulting in reduced cost and faster time-to-market. Unlike traditional camera module designs that combine image sensors and lenses in a barrel, OmniVision devices are assembled using wafer level alignment tools. The lens can be placed directly onto chip scale packaged (CSP) image sensors, which eliminates the need for flex cables and interposers.