Advanced Imaging


Advanced Imaging Magazine

Updated: January 12th, 2011 09:49 AM CDT

Taking a Look at Wafer-Level Packaging

Meeting consumer demand for increased features on camera phones and other mobile devices
An image sensor packaged at wafer level and provided with a ball grid array interface to simplify and reduce the cost of attachment to a printed circuit board.
Comparison of a conventional cell phone camera with an OptiML module from Tessera.

By Barry Hochfelder

The number of lens wafers required to build the optical module is set by the optical requirements of the camera module. The lens wafers are then aligned and bonded at the wafer level, and diced into individual, integrated optical stacks that are mounted on top of a wafer-level packaged image sensor. The accuracy of the wafer stacking process optimizes the performance of integrated optics and packaged image sensors.

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