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Advanced Imaging Magazine
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Updated: January 12th, 2011 09:49 AM CDT
Taking a Look at Wafer-Level Packaging
Meeting consumer demand for increased features on camera phones and other mobile devices
An image sensor packaged at wafer level and provided
with a ball grid array interface to simplify and reduce the cost of attachment to a printed circuit board.
Comparison of a conventional cell phone camera with an OptiML module from Tessera.
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The number of lens wafers required to build the optical module is set by the optical requirements of the camera module. The lens wafers are then aligned and bonded at the wafer level, and diced into individual, integrated optical stacks that are mounted on top of a wafer-level packaged image sensor. The accuracy of the wafer stacking process optimizes the performance of integrated optics and packaged image sensors.
