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CInvensense Closes Its Second Round of Funding of $11 Million
InvenSense (Santa Clara, Calif.), a leading provider of integrated motion sensing solutions for mobile and consumer applications, announced it has secured $11 million in Series B funding. The infusion will finance the company's high-volume production ramp for its popular integrated dual-axis gyroscope and will fund the completion of new product development for the handset market. QUALCOMM Ventures participated in the round, along with existing investors Artiman Ventures and Partech International, who fully participated in the round.
The new round of funding is the next step in the company's strategy to pursue new market opportunities for integrated motion sensing in consumer electronics, including gaming and mobile handsets. Using its initial round of funding, InvenSense was able to complete development, testing and production of hundreds of thousands of units for its flagship IDG product family of dual-axis gyroscope, and to secure multiple design wins with major consumer electronics OEMs, including Sanyo Electronics.
The dual-axis gyroscope offers precision motion sensing accuracy through the measurement of rotational movement. Current applications include image stabilization in digital still cameras (DSCs), camera phones and motion sensing for 3D computer mice.
Samsung Samples First 50-nanometer 16Gb NAND Flash for Solid State Disk and Other High-density Applications
Samsung Electronics Co., Ltd., (Seoul, Korea) a world leader in advanced semiconductor technology solutions, announced that it is now sampling its 16-gigabit NAND flash memory with customers - the first NAND flash using 50 nanometer process technology.