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Advanced Imaging Magazine

Updated: July 8th, 2008 05:26 PM CDT

Industry News for January 2006

End view of the IntellX gantry system showing the container scan tunnel.
GIS data helps create realistic virtual environments for the INTERSAT Virtual Reality Simulator.
The Handyscan 3D.
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By Advanced Imaging Editorial Staff

Container Scanning Helps Secure Ports and Borders

Border security is a crucial concern, and one that is shown to need more improvement in the face of the modern terrorist threat. BIR Inc.’s Security Systems Division (Lincolnshire, IL) has been awarded a delivery order by the Department of Homeland Security (DHS), Customs and Border Protection (CBP) for BIR’s IntellX™ Gantry Vehicle and Container Inspection System. The IntellX™ system combines a 6MV Varian linear accelerator with a BIR proprietary detection system designed for scanning high-density cargoes. The IntellX™ system offers all the performance of a fixed installation, but can be disassembled and redeployed at any border location, adding a dimension of flexibility and cost-effectiveness to CBP planning that normal fixed systems do not provide.

Its high-energy x-ray imaging system non-intrusively examines densely packed cargo containers, tanker trucks or vehicles. With its regional partners, it helps port authorities and government agencies comply with the US Container Security Initiatives (CSI) through system design, radiation safety, financing and post installation service.

Radiation safety tests performed on the IntellX™ system and evaluated by an independent regulatory agency have demonstrated its safety even for someone inside the container during a scan. “The safety factor has been one reason that high-energy x-ray cargo systems have been scrutinized in North America, and the IntellX™ system removes that concern” said Kevin Igielski, general manager, BRI Security Systems Division.

The delivery order was placed under a multiple award, firm fixed-price, indefinite quantity contract that DHS awarded to BIR in September 2005. The contract is for one year with four one year renewable option periods.

Goodrich Awarded Research & Development Contract from U.S.

Goodrich Corporation (Charlotte, NC) has been awarded a contract from the U. S. Army’s RDECOM CERDEC Night Vision and Electronic Sensors Directorate to design, develop and deliver an indium gallium arsenide (InGaAs) detector array for use in high definition (1920x1080 pixel) shortwave infrared (SWIR) night vision cameras. The contract will further the development of high resolution, small pixel pitch, high sensitivity, dual-wavelength cameras that can simultaneously produce images in both the visible and the shortwave infrared wavelength regions. This will allow users to image under the darkest of night conditions in a new wavelength band and will enable backward compatibility with older imaging technologies. The project will be conducted by the company’s Optical and Space Systems team (formerly Sensors Unlimited) in Princeton, N.J. Goodrich’s research and development will focus on the design of an improved readout integrated circuit (ROIC) architecture with an unprecedented 12mm pixel pitch thus allowing for a tiny array with high resolution. This minimizes the weight and size of the optical assembly for long- range imaging. With the small pixel pitch and resultant smaller diode collection area, the new device will feature an improved ROIC design with lower read noise offering higher resolution than is currently available in a small array. Work will also focus on improving the visible response from the current, commercially proven indium phosphide (InP) substrate removal process. These improvements will result in higher device yields which will lower the cost per unit and provide much higher sensitivity in dark or low light conditions. The new ROIC and the improved substrate-removed InGaAs photodiodes will be integrated into the new imager. The resulting camera will have the potential for both commercial and defense applications in areas such as covert surveillance, optical coherence tomography, hot end process inspection (e.g. glass and steel), spectroscopy and a variety of other machine vision tasks.

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