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About Toshiba's Mobile Strategic Initiative
Toshiba's Mobile Strategic Initiative, announced in 2007, combines an expanded product portfolio, support tools (color tuning, reference designs and evaluation boards) and the company's cooperation with baseband, application processor, I/O and core vendors to help TAEC customers address tough issues facing the current and future mobile handset/portable consumer electronics designs, including system integration, emerging standards and interoperability. Additionally, TAEC provides local application and design-in support and access to a host of analog peripheral ICs from other Toshiba divisions and business units, including the Toshiba Dynastron CMOS image sensor/module family, LCD drivers, I/O expanders, memory products and LCD panels.
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, distributions and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, discrete devices, displays, advanced materials, medical tubes, custom SoCs/ASICs, digital multimedia and imaging products, microcontrollers and wireless components that make possible today's leading cell phones, MP3 players, cameras, medical devices, automotive electronics and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's third largest semiconductor manufacturer (Gartner, 2008 WW Semiconductor Revenue Estimate, Dec. 2008 ). For additional company and product information, please visit http://www.toshiba.com/taec/.
Trademarks and trade names appearing herein are the property of their respective owners and may be registered in the United States and other jurisdictions.
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at www.chips.toshiba.com, or from your TAEC representative.
SOURCE Toshiba America Electronic Components, Inc.