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The Common Platform partners expect to continue to expand the eco-system in this collaborative initiative to include more members in the near future. These additional partners will expand the offering of EDA support, services and IP offerings to enable customers to accelerate their time to market on these advanced technologies.
"IBM remains convinced collaborative innovation in an open ecosystem of partners is the key to technology leadership, both now and in the years to come," said Mike Cadigan , general manager, Semiconductor Solutions, IBM. "Today's announcement with ARM extends that strategy to the next level, from IBM research through Common Platform manufacturing to the leading consumer application architecture. With the extensions of our agreements to the 32nm generation, IBM is working together with its alliance partners to deliver leading-edge technology that promises to dramatically change the way we live, work and play."
"Today, customers require a new level of ecosystem interdependancy to address the complexity of total system solutions. ARM's collaboration with the Common Platform partners will drive a new level of optimized, power-efficient SoCs," said Chia Song Hwee , president and CEO of Chartered. "The Common Platform's joint development and ecosystem collaboration is the leading model for moving invention to open industry access."
"This collaboration provides our mutual customers with leading design solutions that combine our HKMG breakthroughs in 32nm process technology and ARM's optimized low-power, high-performance cores and libraries," said Dr. Chang Sik Choi, executive vice president, Samsung Electronics Co., Ltd. "With high volume manufacturing in our Common Platform fabs, customers will benefit with time to volume advantages critical to success in the fast moving consumer electronics market."
About the Common Platform
IBM, Chartered Semiconductor Manufacturing and Samsung Electronics have forged a unique manufacturing collaboration featuring bulk CMOS 32nm, 45nm, 65nm and 90nm process technologies. By combining the expertise and research resources of all three companies and leveraging advances such as high-k metal gate technology, 193nm immersion lithography and ultralow-k dielectrics, the Common Platform(TM) technology collaboration is able to accelerate the availability of leading-edge technology to foundry customers. The Common Platform model is supported by a comprehensive design-enablement ecosystem, enabling foundry customers to easily source their chip designs to multiple 300-mm foundries with minimal design work and with unprecedented flexibility and choice.