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ARM, Chartered, IBM and Samsung Collaborate to Enable Energy-Efficient 32nm and 28nm Systems on Chip
SANTA CLARA, California and CAMBRIDGE, England , September 29 /PRNewswire-FirstCall/ -- IBM (NYSE: IBM), Chartered Semiconductor Manufacturing Ltd. (Nasdaq: CHRT, SGX-ST: CHARTERED) Samsung Electronics, Co., Ltd., and ARM [(LSE: ARM); (Nasdaq: ARMH)] today announced they will develop a comprehensive 32 nanometer (nm) and 28nm Systems-on-a-Chip (SoCs) design platform based on high-k metal-gate (HKMG) technology from the IBM-led joint-development alliance.
Under this multi-year collaboration, ARM will develop and license a design platform of physical intellectual property (IP) including logic, memory and interface products for the Common Platform technology alliance of IBM, Chartered and Samsung for distribution to their customers
ARM also announced its intent to develop customized physical IP targeted at achieving optimal power, performance, and area for their current and future Cortex(TM) processor family leveraging the unique attributes of the Common Platform HKMG 32nm/28nm technology. The HKMG technology breaks down the historical barrier of scaling, allowing significant power and performance advantage by utilizing new material science innovations. This technology targets a broad range of embedded segments, including mobile, portable and consumer electronics.
The early parallel development work between ARM and the Common Platform alliance leverages their respective industry-leading expertise in processor IP, physical IP and technology development. This combination will facilitate design scaling and accelerate the market availability of next generation mobile devices with unmatched performance, outstanding battery life and reduced cost.
"Through this early engagement, we are creating the foundation for designing power-efficient ARM(R) SoCs for customers of the Common Platform," said Warren East , CEO, ARM . "By utilizing the strength of our advanced microprocessors, our leadership in Physical IP design and advanced technology supported by the Common Platform, customers can accelerate the release of products for electronic devices that service a broad range of consumer applications."
