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About Tracit Technologies
Tracit Technologies specialises in thin-film layer transfer technologies that leverage direct wafer bonding and thinning processes. This technology allows to transfer fully processed layers as well as partially processed layers, onto various supports in order to achieve new structures. A recent strategic acquisition of the Soitec Group (Euronext, Paris ), the world's leading innovator and provider of engineered substrates, its intellectual property is complementary to Soitec's Smart Cut(TM) technology. TracitTechnologies enables Soitec to expand its markets reach offering new engineered substrates (patterned BSOI, debondable BSOI etc.) for MEMS and Power ICs, as well as offering service access to its generic circuit transfer technology for applications such as image sensors and 3D integration. Following an initial development phase, Tracit Technologies, with its confirmed potential growth, is quickly moving to production to satisfy the needs of its customers throughout Europe , North America and Asia.
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