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"We were able to take advantage of the post-bubble doldrums to make significant improvements in the structure and packaging of the components that deal with electrical-to-light conversion and vice versa," said Dr. David Rolston, Co-Founder and CTO.
"Our optical sub-assembly, which incorporates our proprietary LightABLE(TM) optical engine technology, features a unique low cost, low profile, passive optical assembly process whose modular construction allows for volume manufacturing, superior performance and much higher reliability as compared to existing technology implementations developed some years ago and still in the market. We basically handle high data rates faster, better and less expensively than any competing technology - and by quite a bit," added Dr. Rolston.
Reflex Photonics "Light on Board(TM)" is the company's umbrella notion of what its products accomplish. Later this year, the company will introduce its industry-leading chip-to-chip and fiber-to-the-chip capabilities regarding optically-enabled, LightABLE(TM) hybrid semiconductor IC packaging solutions.
These LightABLE(TM)-enabled semiconductor IC packages will revolutionize the way processors and high-performance chips communicate by using multi-channel, optical fiber ribbon cables or optical waveguides, instead of copper traces, to carry data onto, across and within standard printed circuit boards. PCI, PCI-X, PCI Express, HyperTransport(TM), RapidIO and other proprietary onboard physical layer protocols will be supported by the company's Light On Board(TM) solutions.
"Our goal is to provide a terabit of data through our multi-channel ports, with multiple ports embedded within targeted Flip Chip (FC)-Ball Grid Array (BGA) chip carrier packages. We intend to be the driving force behind the industry's acceptance of optically-enabled, opto-electronic printed circuit board modules and their optical pathways," stated Moskovitz.